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7 Media
GAIA-X 4 moveID project develops basis for secure mobile data exchange

08.09.2022

Press release

Business/economy

GAIA-X 4 moveID project develops basis for secure mobile data exchange

Stuttgart, Germany – Which parking garages currently have vacant charge spots available? Where are free parking spaces in the city center? And how can this information be digitally transmitted, and services billed, across providers? The answer to these and similar questions calls for secure data exchange between the vehicles and their environment. It is precisely this foundation that a research project consisting of universities, automotive suppliers, and system providers is now in the process of building, with Bosch leading the consortium. Over the next three years, the GAIA-X 4 moveID project is set to develop the necessary standards and technological concepts to enable the secure exchange of information between providers of mobility applications and their customers. The goal is to create decentralized digital vehicle identities. This is an important prerequisite for the mass use of electric vehicles, automated driving, and the establishment of connected cities. GAIA-X 4 moveID is supported to the tune of 14 million euros by the German Federal Ministry for Economic Affairs and Climate Action – covering half of the project costs.Connectivity for digital services across the board “An integrated and transparent system architecture for the exchange of data on the road that incorporates different products and players simply isn’t available today. While it’s true that some companies out there already offer services, those services are tailored for specific applications, vehicles, or customer groups,” explains Peter Busch, project manager at the consortium leader Bosch. They often map the infrastructure, for example, but they rarely provide information about availability due to a lack of connectivity between the many independently operating service providers. “Open standards are needed so that users, for example, can find all available charging stations or pay for charging processes,” Busch says. It’s important to always ensure that the data is processed securely and that individual providers don’t exploit it solely for their own purposes. For Busch, this is the only way that the necessary user confidence can grow and a broad range of all available services, such as so-called deep parking (use of otherwise unavailable parking spaces), can be created. That is why the consortium is building on the European GAIA-X system, which defines the technological, economic, and legal framework for a secure and trustworthy data infrastructure. GAIA-X relies on decentralization and the interplay of different cloud providers under common guidelines. In this spirit, the GAIA-X 4 moveID project is using open source software for its developments and making them available to all providers for various business models. Vehicles are becoming marketplaces The standards that GAIA-X 4 moveID is pursuing will allow vehicles to securely and independently exchange information with other vehicles and their environment without an “intermediary.” The vehicles’ “infrastructure partners” include charge spots, barriers, traffic lights, and parking lots. The research project will use internationally recognized hardware and software to develop management and administrative services to facilitate the interaction and trade between different players. This will enable providers to connect a great many services, such as news, entertainment, and navigation, with the car’s system, especially in automated driving. The market for services related to connected parking alone is estimated to be worth ten billion euros annually worldwide. What’s more, the ability to navigate directly to a vacant parking space significantly reduces congestion and emissions. After all, today, about a third of downtown urban traffic is people looking for parking spaces. The availability of information is also a crucial factor for the success of electromobility. It is estimated that about half of newly registered cars in Europe will be electric by 2030. “Their drivers need to know that they’ll be able to find a charge spot quickly whenever they need one. And that requires connected systems,” Busch says. Extensive data exchange as a basis for automated driving The mass use of automated vehicles is conceivable only if cars are able to quickly and reliably communicate with their environment. The data exchange this requires will enable climate-friendly traffic control based on the volume of traffic at any given moment. This will allow cities to regulate incoming traffic to particular areas in real time, thus preventing congestion. However, this method, known as zoning, requires that vehicles be able to immediately recognize changing conditions and to reroute accordingly. Zoning is being demonstrated with test vehicles – for the first time across borders – in the Germany-France-Luxembourg (Merzig/Saarbrücken) test area as part of the GAIA-X 4 moveID project. The cars receive dynamic information regarding their approach to defined zones.The project partners: Robert Bosch GmbH Materna Information & Communications SE Denso Automotive Deutschland GmbH Continental Automotive Technlogies GmbH WOBCOM GmbH ecsec GmbH HTW Saar (University of Applied Sciences) Atos Information Technology GmbH Chainstep GmbH Peaq Technology GmbH Zeppelin Universität gGmbH (Zeppelin University) Datarella GmbH 51nodes GmbH Bigchain DB GmbH Fetch.ai Research & Development GmbH ITK Engineering GmbH Deutsche Zentrum für Luft- und Raumfahrt e.V. (German Aerospace Center) Airbus Defence and Space GmbH Delta Dao AG

Business/economy
CES 2019: Bosch extends its position as a leading IoT company

07.01.2019

Press release

Smart Home

CES 2019: Bosch extends its position as a leading IoT company

Las Vegas, NV – More and more, the internet of things (IoT) is changing our world. At CES 2019 in Las Vegas, Bosch is showing what it is already capable of today. From a concept for a shuttle vehicle that makes a new kind of mobility tangible, to fridges with connectivity that give advice on food storage, to smart lawn mowers that learn by doing – the spectrum of solutions Bosch is presenting at the world’s largest consumer electronics show is huge. “Bosch recognized the huge opportunities of the IoT early on. We have been actively shaping the connected world for nearly ten years now,” says the Bosch board of management member Dr. Markus Heyn. “Today, we are a leading IoT company. Step by step, we have extended our software and IT expertise.” Using its own IoT cloud, the company has already carried out more than 270 projects in field such as mobility, smart homes, smart cities, and agriculture. The number of sensors and devices connected over the Bosch IoT Suite has risen nearly 40 percent since last year, and now stands at 8.5 million.One of the keys to further growth and new business opportunities on the internet of things is artificial intelligence (AI). This is also a field in which Bosch is playing a decisive part in driving developments. “We will best be able to unlock the potential of the IoT if we combine it with AI, and take our IoT and AI activities forward in parallel,” Heyn says. In his view, the relationship between the two fields is complementary: “The IoT needs intelligence. The use of connected things to gather data can be a decisive boost for the development of AI. It is only through AI that connected things become intelligent and learn to draw their own conclusions. Above all, we aim to achieve concrete improvements in people’s real, everyday lives – things such as more time, more security, more efficiency, and more convenience.” Here, Heyn cites the example of video-based fire detection: by using intelligent image analysis, security cameras are able to identify fires within a few seconds, even before the system’s sensors detect heat and smoke. In this way, fires can be detected considerably earlier than with conventional fire or smoke alarm systems. This saves valuable minutes in which lives can be saved.A second key to success on the path to the IoT age is partnerships. Here, Bosch is opting for a mix of traditional and new players. The alliance recently agreed with the Canadian platform provider Mojio has already resulted in the first integrated IoT platform for connected vehicles: in the event of an accident, a special Bosch algorithm can identify where and when the accident happened, and how severe it is. Via the Mojio cloud, the data are transmitted without any delay to the Bosch emergency service center, which automatically sends an emergency call to local rescue services. At the same time, a message is sent to a predetermined list of recipients, either as a text message or via the Mojio app. “Together with Mojio, we are connecting vehicles directly with the cloud. This means rescue services can get to the scene of an accident even faster than before,” says Mike Mansuetti, the president of Bosch North America. From the middle of next year, the IoT emergency solution will be available for nearly a million drivers in North America and Europe. IoT on the roads: Bosch presents connected mobility of the future With the concept shuttle vehicle it developed in-house, Bosch is celebrating a world first at CES. In this vehicle, the company is its presenting solutions for the automation, connectivity, and electrification of vehicles, and is giving visitors the chance to experience at first hand a new kind of mobility: driverless shuttles, which will soon be a feature on the streets of the world’s cities. “This will pay into our vision of mobility that is as emissions-free, accident-free, and stress-free as possible,” Heyn says. For shuttle-based mobility such as this, Bosch will be supplying not only components and systems, but also a complete range of mobility services, such as reservation, sharing, and connectivity platforms, as well as parking and recharging services. Bosch believes that such connected services are essential for the shuttle-based mobility of the future. The forecast market volume for these services is also high: while it was 47 billion euros in 2017, it is estimated that it will be as much as 140 billion euros by 2022 (source: PwC). Bosch also wants to have a share in this, and aims for significant double-digit growth with the solutions it offers. For Heyn, there is no doubt: “In the future, every vehicle on the road will make use of Bosch digital services. We will consolidate them into a smart, seamlessly connected ecosystem.”One of the final obstacles for putting shuttle-based mobility into practice is the automation of vehicles in complex urban environments. Here, Bosch believes partnerships are the answer: In the second half of this year, San José in California’s Silicon Valley is set to become the pilot city for testing a fully automated, driverless ridesharing service provided by Bosch and Daimler. The three parties have already signed a letter of intent to this effect. With their development alliance, Bosch and Daimler want to improve urban traffic flows, enhance road safety, and provide an important building block for the traffic of the future. Their aim is to develop a driving system for fully automated driverless driving (SAE level 4/5) that is ready for production by the beginning of the next decade. IoT in the home: connected appliances make home owners’ lives noticeably easier It’s not just on the roads that connected products and services that make user’s lives easier are in demand. “We’re working on the idea of a connected home, and on appliances that think autonomously and understand what users want,” Heyn says. At CES, for example, the company is presenting a new function for web-enabled fridges that can recognize types of food and provide recommendations on storage. The interior camera automatically recognizes some 60 kinds of fruits and vegetables and suggests the ideal place to store them by means of an app. As a result, food is stored in the best possible way, stays fresh for longer, and doesn’t have to be thrown away so often. Another new development is the PAI projector, which can project a virtual user interface onto a kitchen counter top. An integrated 3D sensor captures any hand movements, allowing touch-screen operation of the interface. In this way, users can conveniently call up recipes online and make phone calls over the internet while they are cooking and baking. Designed especially for the kitchen environment, PAI does not have to be used with as much care as a smartphone or tablet. Even with sticky fingers, the projector can still be controlled perfectly. PAI is set to debut in China in February 2019, to be followed by market launch in the United States. Bosch is also presenting the Indego S+, its new robot lawn mower with internet connectivity, at CES. It is one of the first robot lawn mowers in the market to offer voice control by Amazon Alexa. It is also the only robot lawn mower that can use weather forecasts on the web to automatically decide when best to mow the lawn again. Bosch is using artificial intelligence to improve the way its robot lawn mower recognizes obstacles on the lawn by evaluating data such as motor flow, acceleration, motor speed, and direction. “We are using AI to make lawn care even easier and more convenient. Our vision is an Indego that adapts to its garden in order to mow the lawn perfectly every time,” Heyn says. IoT #LikeABosch: Bosch launches digital IoT campaign Bosch is also using CES 2019 to premiere its new IoT image campaign. The main plank of the campaign is a hip-hop video clip featuring a protagonist who is a savvy IoT user. Bosch is entering new territory with its “Like a Bosch” campaign; the decidedly different approach and tone marks a new departure for the company, which was founded in 1886.This PR move capitalizes on a rash of “like a boss” videos and memes that have gone viral on the internet, attracting tens of millions of clicks. These videos feature everyday people who stage bizarre stunts or find their way out of predicaments with technical finesse. The IoT image campaign changes a few letters in order to put a fresh spin on this internet phenomenon. The protagonist in the Bosch video is a young man who is always on top of things, thanks to connected solutions from Bosch. Smartphone in hand, he operates his car, lawn mower, or coffee machine in a cool, smart, and confident way – he’s in charge of things “like a Bosch.”

Smart Home
Bosch lets CES 2019 visitors experience tomorrow’s shuttle mobility

04.01.2019

Press release

Connected mobility

Bosch lets CES 2019 visitors experience tomorrow’s shuttle mobility

Las Vegas – Driverless, electric, and seamlessly connected: shuttles will soon be a common sight on our city streets. Bosch provides components and systems for automating, connecting, and electrifying the shuttles. And it also provides a smart ecosystem of mobility services, including booking, sharing, and networking platforms, parking and battery charging services, and software solutions for managing and maintaining the vehicles, as well as infotainment during the journey. “In the future, every vehicle on the road will make use of Bosch digital services,” says Dr. Markus Heyn, member of the board of management of Robert Bosch GmbH. At CES 2019 in Las Vegas, Bosch is presenting its solutions for this area of transportation with a concept shuttle that lets visitors experience its full range of services.

Connected mobility
Germany, high-tech hub: Semiconductors pave the way for better quality of life.

25.06.2018

Presentations

Business/economy

Germany, high-tech hub: Semiconductors pave the way for better quality of life.

Check against delivery.Ladies and gentlemen, It’s been only roughly a year since we jointly announced the decision to build a new plant for 300 mm wafers. Now here we are, following a complex planning process, laying the foundation stone for Bosch’s chip factory of the future. With it, we are laying the foundation for improving people’s quality of life, the foundation for more safety on the road – and the foundation for a technology crucial to the internet of things and the mobility of the future. Semiconductors are a core component of all electrical systems. Semiconductors are also turning data into a coveted raw material of the future – none of the cars made today would be able to drive without them. They enable automated and efficient driving, and provide the best passenger protection – such as when they are called on to deploy airbags. With the areas of application for semiconductors becoming larger and larger, we are expanding our manufacturing capacity. As a location, we have opted for Germany. With this plant, we are entering into 300 mm wafer production for the first time, in a drive to achieve further significant economies of scale and to bolster our competitiveness. We see Dresden, the capital of Saxony, as a driver of microelectronics in Europe – and thus as the first choice worldwide for our billion-euro investment. I firmly believe high-tech is something Germany does well. By working closely with semiconductor companies, researchers, and universities, we aim to strengthen both our innovative strength and the competitiveness of this high-tech industry – in Germany and throughout Europe. Ladies and gentlemen, every day in our wafer fab, we will use highly automated manufacturing processes to create the future in the shape of semiconductors. But we will be doing more than that: we’ll also be creating prospects for the future in the shape of highly attractive jobs. Our high-tech factory will employ up to 700 people. We are looking for creative minds – people who can bring their expertise to bear on the construction of this state-of-the-art Bosch wafer fab. We are counting heavily on finding specialists here in the region as well as international specialists and experts. Our new construction project is also the biggest single investment in Bosch history. We are putting roughly one billion euros into our new location, and are pleased that the German Ministry for Economic Affairs and Energy plans to support its construction and commissioning. And in addition to the federal government, the state of Saxony and the city of Dresden have also pledged their support. So at this point, I wish to express my thanks to you, Minister Altmaier, and you, Minister-President Kretschmer. It is also thanks to you and your predecessors that things have moved so fast, and we find ourselves here today, ready to lay the symbolic foundation stone together – for better quality of life, for the semiconductor industry in Dresden, and for the competitiveness of Germany as a high-tech location.

Business/economy
Bosch lays foundation stone for factory of the future

25.06.2018

Press release

Business/economy

Bosch lays foundation stone for factory of the future

Stuttgart and Dresden, Germany – The foundation stone laid today in Dresden is a key milestone in the construction of the Bosch Group’s state-of-the-art wafer fab. Construction is scheduled to be completed in late 2019, when installation of the production machinery will start. “Today we are laying the foundation stone for the wafer fab of the future, and with it the foundation for improving people’s quality of life and their safety on the road,” said Dr. Dirk Hoheisel, member of the board of management of Robert Bosch GmbH, at the formal ceremony in Dresden. “Semiconductors are the key technology for the internet of things and the mobility of the future. When installed in cars’ control units, for example, they enable automated, efficient driving and the best possible passenger protection.” In his address, Peter Altmaier, the German Federal Minister for Economic Affairs, underlined the central importance of this Bosch investment: “We are today taking an important step toward securing the future competitiveness of Germany as an industrial location. The research community in Germany and Europe is an excellent one, but we cannot afford to rest on our laurels. In the field of microelectronics, we also need engineering skills and know-how, and especially industrial-scale manufacture and application, in Germany and Europe. Today’s ceremony is an important step on this route.” As a supplier of technology and services, Bosch is investing roughly one billion euros in its new location in the Saxony state capital. The first associates are due to start work in the new plant in early 2020. Today we are laying the foundation stone for the wafer fab of the future, and with it the foundation for improving people’s quality of life and their safety on the road....Dr. Dirk Hoheisel After Reutlingen, the Dresden plant is the Bosch Group’s second wafer fab in Germany. With it, the company aims to expand its manufacturing capacity, and thus to boost its competitive edge in global markets. Semiconductors are finding their way into more and more applications relating to the internet of things and mobility solutions. According to the market research company Gartner, semiconductor sales around the world rose by some 22 percent in 2017 alone. Otto Graf, who will manage the new plant, said: “Construction is proceeding right on schedule. “During the construction phase, we will move some 7,500 truckloads of earth, lay about 80 kilometers of piping and ductwork, and mix more than 65,000 cubic meters of concrete – 8,000 concrete mixers-worth.” Following a rollout phase, pilot manufacturing operations are expected to start at the end of 2021. The plot of land – measuring some 100,000 square meters, or roughly 14 soccer fields – will also be home to a nearly 72,000 square-meter multistory building housing offices and production space. Up to 700 associates will be involved in the highly automated chip manufacturing process, working to plan, manage, and monitor production. This also includes modifying the production processes and evaluating the data from Dresden in Bosch’s global manufacturing network. Saxony as a business location: driving Europe’s microelectronics industry “Bosch’s decision is an important milestone. The construction of the new wafer fab here in Dresden will create many other attractive jobs, strengthen Saxony’s reputation as a location for technology and business, and is good for Germany and Europe as well. This project will play a decisive part in securing a leading role for European industry as a whole in the technologies of the future,” said Michael Kretschmer, the Minister-President of the state of Saxony. “This investment in such a major project is a sign of confidence in Saxony, in its people, in the research and industrial network that has become established here, and in its innovativeness.” In its search for a new location, Bosch considered several cities around the world. In Hoheisel’s words, “Dresden is an excellent microelectronics cluster.” He added that the city’s infrastructure is excellent: everything is easily accessible, and the transportation connections are good. The cluster also includes automotive suppliers and service providers, as well as universities offering technological expertise. As Hoheisel pointed out: “We want to work closely with semiconductor companies and universities to increase semiconductor technology’s competitive edge – not only in Germany, but across Europe.” We are today taking an important step toward securing the future competitiveness of Germany as an industrial location....Peter Altmaier, the German Federal Minister for Economic Affairs Semiconductors: key technology for the internet of things Manufacturing semiconductor chips always starts with a silicon disc, or wafer. The bigger the wafer’s diameter, the more chips that can be made per manufacturing cycle. This is one reason why the new Bosch factory will focus on the production of 300 mm wafers: Compared with conventional 150 and 200 mm wafer fabs, 300 mm wafer technology offers greater economies of scale. Semiconductors are extremely small integrated circuits with structures measured in fractions of a micrometer. Manufacturing them requires a highly automated and complex process consisting of several hundred individual steps over several weeks. It takes place in clean-room conditions, as even the tiniest particles in the ambient air can damage the delicate circuits. Connected manufacturing: 22 metric tons of data a day for higher quality Wafer production is one of the forerunners of connected manufacturing. The Dresden plant is expected to generate production data equivalent to 500 text pages per second – written out on paper, that would be more than 42 million pages a day, weighing 22 metric tons. This is why artificial intelligence will play a special part in chip manufacturing in the factory: the highly automated production facilities analyze their own data in order to optimize their processes. As a result, the quality of the chips rises while production costs go down. Furthermore, planning and process engineers can access this production data at any time to accelerate the development of new wafer products or minimize tolerances early on in the manufacturing process. “We need creative minds for our connected and automated manufacturing operations – particularly experts in wafer technology, like process engineers, mathematicians, or software developers,” Graf said. Many new associates have already been hired for the Dresden plant, he added, and there has been no drop in the number of applications. Leading semiconductor manufacturer with 45 years of experience For more than 45 years, Bosch has been making semiconductor chips in various forms, above all as application-specific integrated circuits (ASICs). At its wafer fab in Reutlingen, Germany, Bosch currently manufactures ASICs, power semiconductors, and microelectromechanical systems (MEMS). Bosch ASICs have been used in vehicles since 1970. They are customized to individual applications, and essential for functions such as engine management or airbag deployment. In 2016, every car rolling off the production lines worldwide had on average more than nine Bosch chips on board.

Business/economy

25.06.2018

Factsheet

Business/economy

Semiconductor production at Bosch

Current portfolio Application-specific integrated circuits (ASICs), semiconductors, and mass-flow sensors for vehicle ECUs; acceleration, yaw-rate, and pressure sensors for vehicle ECUs and consumer applications; surround and geomagnetic sensors and projectors for consumer applications Manufacturing locations Reutlingen, Germany (150 mm and 200 mm technology) Patents Bosch holds more than 1,000 patents and patent applications relating to MEMS and semiconductor technology. Market Bosch manufactures semiconductors and MEMS sensors for its own use. A large portion of the portfolio is also offered in the open market. History For more than 45 years, Bosch has been developing and manufacturing microelectronic components and systems; it developed the microfabrication technique for microelectromechanical systems (MEMS) nearly 25 years ago, and is now the world market leader in this field.

Business/economy

25.06.2018

Factsheet

Business/economy

Laying the foundation stone for 300 mm wafer fab in Dresden

General information Total investment approx. 1 billion euros Site approx. 100,000 m2 (about 14 soccer fields) Total floor space approx. 72,000 m² of production area and office space Construction timeline Groundbreaking in spring 2018 installation of machinery mid-/end 2019 pilot production to start at end of 2021 Associates in the completed plant Up to 700 Qualified professionals needed Experts from the semiconductor industry, such as process, production, and maintenance engineers, mathematicians, software engineers, as well as professionals with degrees in physics, chemistry, and microsystems technologies Manufacturing technologye Highly automated wafer production (300 mm silicon substrate wafers with structures up to 65 nm in width – 1 nm equals one millionth of a millimeter) Connected manufacturing Every second, the machines will transmit one gigabit of production data. The volume of data produced is equivalent to more than 42 million written sheets of paper, weighing 22 metric tons.Details on the building Total building volume 600 000 m³ Concrete approx. 66,500 m³ (about 8,300 concrete mixer trucks) Steel approx. 16,400 metric tons (about 30 A380 passenger jets) Earth moved/excavated approx. 90,000 m³ (some 7,500 truckloads) Bored piles for the foundation approx. 860 Floor slabs 100 cm thick Length of piping and ductwork approx. 80 km Length of electrical cabling approx. 380 km (from Dresden to Berlin and back)Internet For job seekers www.bosch-career.de/jobs Site for the Dresden location https://www.bosch.de/en/ourcompany/bosch-in-germany/dresden Bosch semiconductors www.bosch-semiconductors.com

Business/economy