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Semiconductor production at Bosch

04.10.2019

Factsheet

Connected mobility

Semiconductor production at Bosch

Semiconductor production at Bosch Current portfolio Electronic components for vehicles and for consumer electronics. These include microelectromechanical systems (MEMS) such as acceleration, yaw-rate, pressure, mass-flow, environmental, and magnetic field sensors, as well as microprojectors, application-specific integrated circuits (ASICs), and power semiconductors. Manufacturing sites Reutlingen (150-mm and 200-mm technology) Dresden (300-mm technology) from 2022 Patents Bosch holds more than 1,500 patents and patent applications in the field of semiconductor technology, 1,000 of which are for MEMS technology. Market Bosch manufactures semiconductors and MEMS sensors for its own use. Large portions of the portfolio are also offered on the open market. History For nearly 50 years, Bosch has been developing and manufacturing microelectronic components and systems; almost 25 years ago, Bosch developed the semiconductor production process for microelectromechanical sensors (MEMS sensors), and is world market leader in this field.

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Reutlingen wafer fab

04.10.2019

Factsheet

Connected mobility

Reutlingen wafer fab

Reutlingen wafer fab Production facilities 150-millimeter technology since 1995 200-millimeter technology since 2010 Test center for semiconductors Semiconductors have been manufactured at the wafer fab in Reutlingen since 1971. Clean room surface area 23,400 m2 Associates 3,500 Manufacturing technology Partly automated semiconductor production (150-and 200-mm silicon substrates (wafers) with structural widths of up to 180 nm; 1 nm is a millionth of a millimeter) Manufactured products Application-specific integrated circuits (ASICs), microelectromechanical systems(MEMS), power semiconductors Fields of application for semiconductors Automotive electronics: ESP electronic stability program, electronic control units for IC engines and electric motors as well as for transmissions, airbag and driver assistance systems, parking assistants, and night vision enhancement systems Consumer electronics: smartphones, laptops, wearables, hearables, games consoles, drones

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300 mm wafer fab in Dresden

30.09.2019

Factsheet

Connected mobility

300 mm wafer fab in Dresden

General information Total investment approx. 1 billion euros Site approx. 100,000 m2 (about 14 soccer fields) Total floor space approx. 72,000 m² of production area and office space Construction timeline Groundbreaking in spring 2018, installation of machinery mid-/end 2019, pilot production to start at end of 2021 Associates in the completed plant Up to 700 Qualified professionals needed Experts from the semiconductor industry, such as process, production, and maintenance engineers, mathematicians, software engineers, as well as professionals with degrees in physics, chemistry, and microsystems technologies Manufacturing technology Highly automated wafer production (300 mm silicon substrate wafers with structures up to 65 nm in width – 1 nm equals one millionth of a millimeter) Connected manufacturing Every second, the machines will transmit one gigabit of production data. The volume of data produced is equivalent to more than 42 million written sheets of paper, weighing 22 metric tons.Details on the building Total building volume 600,000 m³ Concrete approx. 66,500 m³ (about 8,300 concrete mixer trucks) Steel approx. 16,400 metric tons (about 30 A380 passenger jets) Earth moved/excavated approx. 90,000 m³ (some 7,500 truckloads) Bored piles for the foundation approx. 860 Floor slabs 100 cm thick Length of piping and ductwork approx. 80 km Length of electrical cabling approx. 380 km (from Dresden to Berlin and back)Internet For job seekers www.bosch-career.de/jobs Site for the Dresden location https://www.bosch.de/en/our-company/bosch-in-germany/dresden/ Bosch semiconductors http://www.bosch-semiconductors.com/

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