30.09.2019
Factsheet
Connected mobility
300 mm wafer fab in Dresden
General informationTotal investmentapprox. 1 billion eurosSiteapprox. 100,000 m2(about 14 soccer fields)Total floor spaceapprox. 72,000 m² of production areaand office spaceConstruction timelineGroundbreaking in spring 2018, installation of machinery mid-/end 2019, pilot production to start at end of 2021Associates in the completed plantUp to 700Qualified professionals neededExperts from the semiconductor industry, such as process, production, and maintenance engineers, mathematicians, software engineers, as well as professionals with degrees in physics, chemistry, and microsystems technologiesManufacturing technologyHighly automated wafer production(300 mm silicon substrate waferswith structures up to 65 nm in width – 1 nm equals one millionth of a millimeter)Connected manufacturingEvery second, the machines will transmit one gigabit of production data. The volume of data produced is equivalent to more than 42 million written sheets of paper, weighing 22 metric tons.Details on the buildingTotal building volume600,000 m³Concreteapprox. 66,500 m³(about 8,300 concrete mixer trucks)Steelapprox. 16,400 metric tons(about 30 A380 passenger jets)Earth moved/excavatedapprox. 90,000 m³(some 7,500 truckloads)Bored piles for the foundationapprox. 860Floor slabs100 cm thickLength of piping and ductworkapprox. 80 kmLength of electrical cablingapprox. 380 km(from Dresden to Berlin and back)InternetFor job seekersSite for the Dresden locationBosch semiconductors
