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Semiconductors are finding their way into more and more applications, including in the internet of things and for mobility of the future. The semiconductor fabrication process begins with round discs of silicon known as wafers. At the Bosch fab in Dresden, these wafers have a diameter of 300 millimeters. To produce the coveted semiconductor chips, the untreated – or “bare” – wafers are then processed for several weeks.
Usage for press purposes free of charge with credit “Source: Bosch”.
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