Media-ID #1451842
At this year's PACK EXPO International in Chicago, Bosch Packaging Technology will present its new virtual reality planning tool "Virtual Layout" at booth S-3514. The Bosch software converts a two-dimensional sketch into a three-dimensional image of the planned packaging system within a very short space of time. The system is displayed on the customer's hall plan on a 1:1 scale. In addition, the VR glasses and associated controllers facilitate a virtual walk-through.
Reproduction for press purposes free of charge with credit “Picture: Bosch”