JetCool closes USD 17 million Series A led by Bosch Ventures

Stuttgart, Germany – Bosch Ventures, the corporate venture capital company of the Bosch Group, has completed an investment in JetCool. The start-up is an innovative liquid cooling technology provider, transforming data center cooling performance at chip level. "In the rapidly evolving tech landscape, with advanced AI platforms and complex chip designs, there's an urgent need to address increasing heat, power, and water consumption in data centers", said Bernie Malouin, JetCool CEO. "With support from Bosch Ventures, In-Q-Tel, and our current investors, JetCool is poised to meet this demand and revolutionize the cooling industry."

JetCool designs and delivers a proprietary microconvective cooling technology for high-power electronics, enabling customers in the data centers and high-performance computing to achieve unprecedented compute performance and significant sustainability improvements. Their fluid-to-package/fluid-to-die cooling techniques eliminate all thermal pastes and thermal interface materials, minimizing thermal resistance and therefore improving cooling efficiency.

Saving Water & Energy to enable the AI and High-Density Chip Boom

In the era of Generative AI and dense chip architectures, JetCool's proprietary cooling technology is essential for addressing overheating, enhancing performance, and prolonging the lifespan of computing systems, ensuring they operate at their peak potential without compromising on efficiency or durability. JetCool plays a pivotal role not only in powering high-performance computing and AI operations but also in leading sustainability efforts within the data center industry.

According to JetCool’s published white paper, JetCool can help to reduce the water consumption of data centers by up to 90% and reduce the energy costs by up to 18%. JetCool estimates that a widespread adoption of their technology in the United States alone would save up to 11.1billion kWh in electricity and 150 billion liters of water per year while averting 35 million metric tons of CO₂ emissions globally.

“When a technology that saves natural resources and energy aligns with a rapidly growing market demand, it's crucial to seize this opportunity,” said Dr. Ingo Ramesohl, Managing Director of Bosch Ventures. “JetCool is well positioned to significantly transform the liquid cooling industry on a global scale, and this capital infusion will help drive continued leadership and innovation in this emerging, but soon-to-be essential, technology category.”

The investment also follows two significant industry partnerships forged by JetCool earlier this year. In May, JetCool debuted its SmartPlate System in collaboration with Dell Technologies’ next-generation PowerEdge servers. By adding JetCool's advanced liquid cooling to Dell PowerEdge servers, customers can deploy liquid cooling within the space of a traditional air-cooled server, maximizing server investments while achieving superior computing performance. In June, JetCool announced a collaboration with DuPont to increase the adoption of advanced liquid cooling technology and create a distribution channel to target semiconductor companies in Taiwan and Singapore.

JetCool raised USD 17 million in a Series A funding round led by Bosch Ventures and joined by new investors, including In-Q-Tel. Previous investors Schooner Capital, Raptor, RS Stata and MassVentures also participated in the round.