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In January 2021, Bosch began putting its first wafers through the fabrication process in Dresden. In the six weeks it takes to produce the wafers, they undergo some 250 individual fabrication steps – all of which are fully automated. In the process, minute structures with dimensions measuring fractions of a micrometer are deposited on the wafers. These microchip prototypes can now be installed and tested in electronic components for the first time.
Reproduction for press purposes free of charge with credit “Picture: Bosch”